132 ics absolute maximum ratings 5 b 1 ? parameter symbol ratings unit conditions sla2601m SLA2602M mosfet breakdown voltage v dss 250 v i d =100ua control supply voltage v cc 20 v between v cc and com control supply voltage v bs 20 v between v b and vm1, vm2 output current (continuous) i o 14 7 a t c =25 ? output current (pulse) i op 21 10.5 a pw 100 s, duty=1% fo output current i fo 8ma input voltage v in ?.5 to +7 v en, in, fo power dissipation p d 41.6 w t c =25 ? , all elements operating thermal resistance (junction to ambient air) j-c 3.0 ? /w all elements operating operating case temperature t op ?0 to +100 ? junction temperature (power part) t j 150 ? storage temperature t stg ?0 to +150 ? ratings parameter symbol sla2601m SLA2602M unit conditions min. max. min. max. main supply voltage v bb 200 200 v between v bb and ls/com control supply voltage vcc 13.5 17.5 13.5 17.5 v between v cc and com boot strap capacitor capacity c boot 10 10 uf fo pull-up resistance r fo 0.68 10 0.68 10 k ? fo capacitor capacity c fo 0.001 0.01 0.001 0.01 uf in pin frequency f in 150 150 khz junction temperature t j 125 125 ? recommended operating conditions ratings parameter symbol sla2601m SLA2602M unit conditions min. typ. max. min. typ. max. control supply current i cc 2 2 ma v cc =15v, f o =open boot supply current i b 135 135 ua v b =15v input voltage (en, in, fo) v ih 2 2.5 2 2.5 v v cc =15v v il 1 1.5 1 1.5 v cc =15v input current (en, in) i ih 230 500 230 500 ua v cc =15v, en,in=5v undervoltage lock out (vb) v uvhl 9 11 9 11 v between v b and vm1, vm2 v uvhh 9.5 11.5 9.5 11.5 undervoltage lock out (v cc ) v uvll 10 12 10 12 v between v cc and com v uvlh 10.5 12.5 10.5 12.5 fo pin output voltage v fo (l) 0 10 1 vv cc =15v, f o =open v fo (h) 3.6 5 3.6 5 thermal protection and t dh 135 150 165 135 150 165 ? v cc =15v release threshold t dl 105 120 135 105 120 135 internal dead time t dead 430 430 ns v cc =15v mosfet output breakdown voltage v dss 250 250 vi d =100ua mosfet output leakage current i dss 100 100 ua v ds =250v mosfet dc on resistance r ds(on) 0.11 0.14 0.14 0.185 ? v cc =15v, i d =7a (3.5a for the SLA2602M),en=5v mosfet diode forward voltage v sd 1 1.5 1 1.5 v i sd =7a (3.5a for the SLA2602M) td(on) 1290 1260 high side switching time tr 100 40 ns v bb =200v, v cc =15v, i d =7a td(off) 900 850 (3.5a for the SLA2602M), en=5v, r load tf 30 15 td(on) 1270 1240 low side switching time tr 80 40 ns v bb =200v, v cc =15v, i d =7a td(off) 880 830 (3.5a for the SLA2602M), en=5v, r load tf 30 25 electrical characteristics sla2601m/SLA2602M features ?full-bridge mosfets and a pre-drive ic are integrated into a single package ?supports cmos (3.3 and 5 v) input levels ?built-in undervoltage lock out (uvlo) circuit (auto regression) ?built-in thermal shutdown (tsd) circuit ?built-in dead time function ?sip power package h bridge, enable pin, built-in thermal shutdown circuit 1-3-2 household hid lamp driver ics (t a =25 ? ) (t a =25 ? )
133 ics t ypical connection diagram (unit : mm) external dimensions (zip24 with fin [sla24pin]) 3.2 0.15 31 0.2 24.4 0.2 16.4 0.2 9.9 0.2 12.9 0.2 16 0.2 5 0.5 31.3 0.2 gate burr japan a b max 23 x p1.27 0.7=29.21 1 (including the resin burr) (measured at the tip) 13 57911131517192123 24 681012 14 16 18 20 22 24 0.6 (4.5) +0.15 -0.05 3.2 0.15 x 3.8 2.45 0.2 4.8 0.2 1.7 0.1 4.5 0.7 r-end (measured at the root) (measured at the tip) pins 4, 5, 8, 9, 16, 17, 20, and 21 are cut pins. 9.5 +0.7 -0.5 0.5 +0.15 -0.05 4-(r1) 3.2 0.15 31 0.2 24.4 0.2 16.4 0.2 9.9 0.2 12.9 0.2 16 0.2 (6.3) 31.3 0.2 gate burr japan a b 2max 23 x p1.27 0.7=29.21 1 (including the resin burr) (measured at the tip) 13 57911131517192123 24 681012 14 16 18 20 22 24 0.6 +0.15 -0.05 3.2 0.15 x 3.8 2.45 0.2 4.8 0.2 1.7 0.1 2.5 0.6 3 0.5 9.3 0.5 r-end (measured at the root) (measured at the tip) pins 4, 5, 8, 9, 16, 17, 20, and 21 are cut pins. (10.4) 0.5 +0.15 -0.05 2-(r1) sla2601m/SLA2602M the input pull-down resistor is built in ic (about 22 k ? ). however, if the input is expected to be unstable or to fluctuate greatly, it needs to be reinforced using an external resistor. attach capacitors near the ic. attach a ceramic capacitor in parallel with the electrolytic capacitor if too much noise is generated. when inserting a current sense resistor between ls1/ls2 and com, make sure to specify the resistance so that the voltage between ls1/ls2 and com is 1 v or less. forming no. 2176 forming no. 2179 pin assignment pin no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 symbol lsi vm1 vm1 (lg1) (lg1) vbb1 vb1 (lg1) (lg1) en in com com vcc fo (lg2) (lg2) vb2 vbb2 (lg2) (lg2) vm2 vm2 ls2 function mosfet l1 source pin/mosfet l2 source pin mosfet h1 source pin/mosfet l1 drain pin same as above cut pin (mosfet l1 gate pin) same as above mosfet h1 drain pin/mosfet h2 drain pin high side floating power supply pin 1 cut pin (mosfet l1 gate pin) same as above input pin for enabling output input pin for switching output pre-drive ic ground pin same as above pre-drive ic power supply pin fo signal output pin cut pin (mosfet l2 gate drive pin) same as above high side floating power supply pin 2 mosfet h1 drain pin/mosfet h2 drain pin cut pin (l2 gate drive pin) same as above mosfet h2 source pin/mosfet l2 drain pin same as above mosfet l1 source pin/mosfet l2 source pin t ruth table & / * / ' 0 ) ) - - - 9 9 0 ' ' 0 ' ' 0 ' ' 0 ' ' 9 9 ) 0 ' ' 0 ' ' 0 ' ' 0 ' ' ) ) - 0 / 0 ' ' 0 ' ' 0 / ) - - 0 ' ' 0 / 0 / 0 ' ' product mass: approx. 6.2 g
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